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Si (Silicon) Rotary Sputtering Target
1.Detail:| Content | Silicon |
| Purity | ≥99.99% |
| Relative Density | ≥96% |
| Resistivity | ≤8Ω·cm |
| Specification | length(max)4000mm*thickness(max)13mm |
| Processing Mode | Plasma spraying |
| Application | Flat panel display |
| Delivery time | 10days after receipt of deposit |
2.Why Us :
| High purity | 99.99% |
| Smaller grain | <100μm |
| density | 2.12g/cm |
| Low resitivity | 10Ω·cm |
3: Production Workflow Chart
4:Packing :
According to customers' request.
5:Impurity Content:
6.Independent intelligent property right
We have obtained 11 independent intelligrnt property rights about sputtering targets and plasma spraying equipments
Fe<=0.001% Cd<=0.0002% Pb<=0.0002% As<=0.0002%
Mn<=0.0005% Cu<=0.0005% K<=0.001% Ca<=0.0003%
6.Independent intelligent property right
We have obtained 11 independent intelligrnt property rights about sputtering targets and plasma spraying equipments
